HyFis

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HyFis Technology

Redefining

Wireless Acoustics

HyFis is Acousbit's proprietary 2.4G wireless acoustic system-on-chip (SoC) solution. It breaks through the limitations of traditional wireless audio, achieving millisecond-level ultra-low latency and 720° sound pickup, serving professional, consumer, and medical applications.

Innovator of AI Acoustic Infrastructure

Technical Positioning

AI's "acoustic neural transmission system" supporting uplink/ downlink/ bidirectional/ broadcast full-interaction modes.

Core Advantages

Full-band coverage from 20Hz-24kHz, millisecond-level ultra-low latency, overcoming traditional Bluetooth's 7000Hz acquisition bottleneck.

Capability Upgrades

Full-frequency data acquisition (enabling "Emotional AI"), multimodal adaptation (supporting "All-scenario Response"), low-latency interaction (delivering "Seamless Experience").

Full-scenario Support

Cellular networks / streaming media / web conferencing / on-site communication.

Millisecond-Level Ultra-Low Latency
Millimeter-Level Chip
Milliampere-Level Power Consumption
20Hz-24KHz Full-Frequency Band
Full Wireless Transmission
720° Immersive Sound Pickup
  • Millisecond-Level Ultra-Low Latency
  • Millimeter-Level Chip
  • Milliampere-Level Power Consumption
  • 20Hz-24KHz Full-Frequency Band
  • Full Wireless Transmission
  • 720° Immersive Sound Pickup

Ultra-low latency communication

Millisecond-Level Ultra-Low Latency

Breaking through the latency constraints of traditional wireless solutions, defining a new benchmark for real-time acoustics.

Millimeter-scale chip dimensions

Millimeter-Level Chip

Utilizing advanced packaging technology, the HyFis chip achieves millimeter-scale (mm) dimensions, occupying just one-third the volume of traditional wireless audio chips while maintaining full acoustic processing and wireless transmission capabilities.

Ultra-low Power Consumption

Milliampere-Level Power Consumption

Through optimized underlying algorithms and low-power circuit design, the HyFis chip operates at milliampere (mA) levels. This significantly extends device battery life while ensuring performance.

Full frequency bidirectional multi-channel transmission

20Hz-24KHz Full-Frequency Band

24,000 Hz full-range coverage captures all the details audible to the human ear (such as instrument overtones and vocal breaths), enabling flexible “lossless + multi-directional” transmission.

Mobile Wireless

Full Wireless Transmission

The HyFis chip natively supports 2.4GHz mobile wireless transmission with anti-interference algorithms. Future expansions will cover the full spectrum including UHF, 5.8G, UWB, and THz, delivering “seamless, high-stability” mobile wireless connectivity.

720 degrees 3D

Immersive Acoustic Capture

Breaking wireless pickup limits, capturing sound assaults from 720°—from near to far, above and below, left and right—reproducing sound memories.

Groundbreaking Wireless Panoramic Audio Technology

Leveraging pioneering wireless panoramic sound technology, ultra-low latency high-fidelity encoding, and advanced acoustic processing, it captures three-dimensional spatial audio details while ensuring stable connectivity in complex environments.

  • Full-scenario Empowerment

    and Future Vision

  • Offline Communication

    Resolving cross-language interference

  • Online Meeting

    Boost Collaboration Efficiency

  • Streaming Media

    Immersive experiences

  • Smart Interconnectivity

    AI acoustic hub

  • “End-to-end optimization (energy efficiency / compatibility / security) propels AI"s evolution from ‘tool’ to ‘partner,’ building a sensory-connected ecosystem where all things coexist.”

  • Energy Efficiency & Computing

    Power Balance

    Reducing terminal power consumption, conserving computing resources for edge AI.

  • Compatibility & Scalability

    Integrate with mainstream AI frameworks, support technical iteration and upgrading.

  • Security & Privacy Protection

    Ensure the Security of Sensitive Voice Data, Ideal for Privacy-Sensitive Scenarios.

Extending the boundaries of sound, shaping

the future of communication.

Dr. Zhang Deming

Founder/Chairman/Chief Scientist

Over 20 years of experience in acoustic audio communication

Profound Academic Background & Industry Expertise:

Bachelor of Physics from Peking University, Ph.D. in Acoustics from the Chinese Academy of Sciences, with over 20 years of experience in acoustic audio and communication technologies.

Industry Leader:

Zhongguancun High-End Leading Talent, Chief Scientist of StarFlash Audio, highly respected in the industry.

Technical Visionary:

Chief Designer of HyFis technology, leading the company’s technology roadmap and securing its undisputed technological leadership.

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Current role is Regular Member

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